Board Materials

Rogers
Isola
Aluminum
Metal Base
Fr4(Tg130/Tg150/Tg170/Tg180)

Polyimide 1mil / 1oz
Polyimide 0.5mil / 0.5oz
Polyimide 2mil / 1oz
Polyimide 3mil / 1oz

Number of Layers

1~40Layers

1~6Layers

Min.Trace/Space

2mil

3mil

Min.Laser Drilling

4mil

4mil

Min.Hole Size/CNC

6mil

6mil

Min.Annular Ring

4mil

4mil

Min.Blind/Buried Via

4mil

/

Hole Plating Thickness

1.4mil (1oz)

1.4mil (1oz)

Final Copper(all layers)

0.3~6oz

0.3~2oz

Surface Finish

ENEPIG
ENIG
Immersion Gold
HASL-Lead
HASL-Lead Free
None / Pure Copper

ENEPIG
ENIG
OSP
Immersion Gold
None / Pure Copper

Finished Board Thickness

0.008"~0.40"
0.2mm~10mm

0.004"~0.08"
0.1mm~2.0mm

Max. Aspect Ratio

12:1

/

Min.Board Dimension

0.2''x0.2"
5*5mm

0.2''x0.2"
5*5mm

Max.Board Dimension

20''x24"
500*600mm

10''x40"
250*1000mm

Solder Mask
LPI
Matte

None
Green
Red
Yellow 
Blue
Black

None
Green
Yellow
Polyimide Coverlay

Silk Screen

None
White
Yellow 
Black
Metal

None
White
Black

Gold Fingers

2μ" ~ 40μ"
0.05μm ~1μm

2μ" ~ 10μ"
0.05μm ~0.254μm

Via Fill
Via in Pad

Copper
Resin

/

Min.Controlled Depth Slot

32*32*4mil

/

Min.Cutout/Slot

32mil

24mil

Min.Plated Slot

20mil

24mil

Min.Castellated Hole

16mil

16mil

Outline Clearance

4mil~12mil

4mil~12mil

Edge Plating

Gold-Plating

/

Controlled Impedance

±8%

±10%

Customized Stackup

Fr4+Rogers
Fr4+Isola
Fr4+Polyimide

Fr4+Polyimide

Stiffener

Fr4

Polyimide
Fr4
Metal

Prototype

24H quick turn

24H quick turn

Production

3~15 business days

3~15 business days

DHL 2nd day Air

2~3 business days

2~3 business days

Min.Order Quantity

1set

Min. Package

0201

BGA Package

BGA Dia    0.006"   (0.14mm)
BGA Pitch  0.008"  (0.20mm)

Assembly Accuracy

0.001"
0.04mm

Min.Board Size

0.2''x0.2"
5*5mm

Max.Board Size

15''x24"
400*600mm

Board Thickness

0.008"~0.1"
0.2~3.0mm

Quality Inspection

AOI
X-Ray

SMT Capacity/Day

1 Million Soldering Pads

DIP Capacity/Day

100 Thousand Pins

Board Types

Rigid
Flexible
Rigid-Flexible
Metal Core

Prototype

24H quick turn

Production

3~15 business days

DHL 2nd day Air

2~3 business days

SMT, Through-Hole & Mixed Technology
Single & Double Sided SMT Assembly

Die min.Pad Size

50 x 50μm
2*2 mil

Die min. Pad Space

25 μm
1mil

Gold Wire

0.7mil
0.8 mil
0.9mil
1.0 mil
1.25mil

PCB Pad surface finish

Immersion Gold
ENIG
ENEPIG
Pure Copper

Encapsulation

Yes/No

Standard Turn Time

1~7 business days

DHL 2nd day Air

2~3 business days