Capabilities
PCB
Assembly
Wirebonding
Items
Rigid Board
Flexible Board
Board Materials
Rogers
Isola
Aluminum
Metal Base
Fr4(Tg130/Tg150/Tg170/Tg180)
Polyimide 1mil / 1oz
Polyimide 0.5mil / 0.5oz
Polyimide 2mil / 1oz
Polyimide 3mil / 1oz
Number of Layers
1~40Layers
1~6Layers
Min.Trace/Space
2mil
3mil
Min.Laser Drilling
4mil
4mil
Min.Hole Size/CNC
6mil
6mil
Min.Annular Ring
4mil
4mil
Min.Blind/Buried Via
4mil
/
Hole Plating Thickness
1.4mil (1oz)
1.4mil (1oz)
Final Copper(all layers)
0.3~6oz
0.3~2oz
Surface Finish
ENEPIG
ENIG
Immersion Gold
HASL-Lead
HASL-Lead Free
None / Pure Copper
ENEPIG
ENIG
OSP
Immersion Gold
None / Pure Copper
Finished Board Thickness
0.008"~0.40"
0.2mm~10mm
0.004"~0.08"
0.1mm~2.0mm
Max. Aspect Ratio
12:1
/
Min.Board Dimension
0.2''x0.2"
5*5mm
0.2''x0.2"
5*5mm
Max.Board Dimension
20''x24"
500*600mm
10''x40"
250*1000mm
Solder Mask
LPI
Matte
None
Green
Red
Yellow
Blue
Black
None
Green
Yellow
Polyimide Coverlay
Silk Screen
None
White
Yellow
Black
Metal
None
White
Black
Gold Fingers
2μ" ~ 40μ"
0.05μm ~1μm
2μ" ~ 10μ"
0.05μm ~0.254μm
Via Fill
Via in Pad
Copper
Resin
/
Min.Controlled Depth Slot
32*32*4mil
/
Min.Cutout/Slot
32mil
24mil
Min.Plated Slot
20mil
24mil
Min.Castellated Hole
16mil
16mil
Outline Clearance
4mil~12mil
4mil~12mil
Edge Plating
Gold-Plating
/
Controlled Impedance
±8%
±10%
Customized Stackup
Fr4+Rogers
Fr4+Isola
Fr4+Polyimide
Fr4+Polyimide
Stiffener
Fr4
Polyimide
Fr4
Metal
Prototype
24H quick turn
24H quick turn
Production
3~15 business days
3~15 business days
DHL 2nd day Air
2~3 business days
2~3 business days
Min.Order Quantity
1set
Min. Package
0201
BGA Package
BGA Dia 0.006" (0.14mm)
BGA Pitch 0.008" (0.20mm)
Assembly Accuracy
0.001"
0.04mm
Min.Board Size
0.2''x0.2"
5*5mm
Max.Board Size
15''x24"
400*600mm
Board Thickness
0.008"~0.1"
0.2~3.0mm
Quality Inspection
AOI
X-Ray
SMT Capacity/Day
1 Million Soldering Pads
DIP Capacity/Day
100 Thousand Pins
Board Types
Rigid
Flexible
Rigid-Flexible
Metal Core
Prototype
24H quick turn
Production
3~15 business days
DHL 2nd day Air
2~3 business days
SMT, Through-Hole & Mixed Technology
Single & Double Sided SMT Assembly
Die min.Pad Size
50 x 50μm
2*2 mil
Die min. Pad Space
25 μm
1mil
Gold Wire
0.7mil
0.8 mil
0.9mil
1.0 mil
1.25mil
PCB Pad surface finish
Immersion Gold
ENIG
ENEPIG
Pure Copper
Encapsulation
Yes/No
Standard Turn Time
1~7 business days
DHL 2nd day Air
2~3 business days